JPH064520Y2 - 温度ヒユ−ズ - Google Patents
温度ヒユ−ズInfo
- Publication number
- JPH064520Y2 JPH064520Y2 JP3169787U JP3169787U JPH064520Y2 JP H064520 Y2 JPH064520 Y2 JP H064520Y2 JP 3169787 U JP3169787 U JP 3169787U JP 3169787 U JP3169787 U JP 3169787U JP H064520 Y2 JPH064520 Y2 JP H064520Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead conductor
- thermal fuse
- sealing resin
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 37
- 239000011347 resin Substances 0.000 claims description 37
- 239000004020 conductor Substances 0.000 claims description 29
- 238000007789 sealing Methods 0.000 claims description 20
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 230000035882 stress Effects 0.000 description 8
- 238000000576 coating method Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007688 edging Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
Landscapes
- Fuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3169787U JPH064520Y2 (ja) | 1987-03-04 | 1987-03-04 | 温度ヒユ−ズ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3169787U JPH064520Y2 (ja) | 1987-03-04 | 1987-03-04 | 温度ヒユ−ズ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63139740U JPS63139740U (en]) | 1988-09-14 |
| JPH064520Y2 true JPH064520Y2 (ja) | 1994-02-02 |
Family
ID=30837671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3169787U Expired - Lifetime JPH064520Y2 (ja) | 1987-03-04 | 1987-03-04 | 温度ヒユ−ズ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH064520Y2 (en]) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0622768B2 (ja) * | 1988-04-05 | 1994-03-30 | 本田技研工業株式会社 | 組付装置 |
| JP2004253218A (ja) * | 2003-02-19 | 2004-09-09 | Nippon Seisen Kk | 小型ヒューズ |
| JP5549427B2 (ja) * | 2010-06-30 | 2014-07-16 | ミツミ電機株式会社 | 温度ヒューズ、温度ヒューズ取付方法および保護装置 |
-
1987
- 1987-03-04 JP JP3169787U patent/JPH064520Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63139740U (en]) | 1988-09-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR920006264B1 (ko) | 반도체장치의 전극접합부 구조 | |
| JPH064520Y2 (ja) | 温度ヒユ−ズ | |
| JPH03190033A (ja) | 非端末キャップ型電気ヒューズ | |
| JPH0797049B2 (ja) | 温度センサの製造方法 | |
| WO2002061768A1 (fr) | Connecteur de resistance et son procede de fabrication | |
| JPS60195955A (ja) | 半導体装置 | |
| JP3938071B2 (ja) | 混成集積回路装置 | |
| JPS5838988Y2 (ja) | 半導体装置用保護素子 | |
| JP2872525B2 (ja) | 回路保護用素子 | |
| JPH06333977A (ja) | 半導体装置及びその製造方法 | |
| JPH073556Y2 (ja) | 温度ヒューズ | |
| JPS6097651A (ja) | 半導体装置 | |
| JPS6017774Y2 (ja) | 温度ヒユ−ズ | |
| JPS6236196Y2 (en]) | ||
| JPH0436025Y2 (en]) | ||
| JPS61177750A (ja) | 半導体装置 | |
| JPH0723866Y2 (ja) | 合金型温度ヒューズ | |
| JPH09159545A (ja) | 温度センサ | |
| JPS5988854A (ja) | 半導体装置 | |
| JPH0343926A (ja) | 温度ヒューズ | |
| JPH0741165Y2 (ja) | 樹脂封止型半導体装置用リードフレーム | |
| JPH0142347Y2 (en]) | ||
| JP2511733B2 (ja) | 合金型温度ヒュ−ズ | |
| JPH0357021Y2 (en]) | ||
| CN111537095A (zh) | 一种温度传感器及其制造工艺 |